APA (7th ed.) Citation

Wahab, Y. A., Fadzil, A., Soin, N., Fatmadiana, S., Chowdhury, Z. Z., Hamizi, N. A., . . . Al-Douri, Y. (2019). Uniformity improvement by integrated electrochemical-plating process for CMOS logic technologies. Elsevier.

Chicago Style (17th ed.) Citation

Wahab, Yasmin Abdul, Anuar Fadzil, Norhayati Soin, Sharifah Fatmadiana, Zaira Zaman Chowdhury, Nor Aliya Hamizi, Omid Akbarzadeh Pivehzhani, Thennarasan Sabapathy, and Yarub Al-Douri. Uniformity Improvement by Integrated Electrochemical-plating Process for CMOS Logic Technologies. Elsevier, 2019.

MLA (9th ed.) Citation

Wahab, Yasmin Abdul, et al. Uniformity Improvement by Integrated Electrochemical-plating Process for CMOS Logic Technologies. Elsevier, 2019.