Singh, G., & Haseeb, A. M. A. (2019). Influence of laser power on bonding strength for low purity copper wire bonding technology. Elsevier.
Chicago Style (17th ed.) CitationSingh, Gurbinder, and A.S. Md. Abdul Haseeb. Influence of Laser Power on Bonding Strength for Low Purity Copper Wire Bonding Technology. Elsevier, 2019.
MLA (9th ed.) CitationSingh, Gurbinder, and A.S. Md. Abdul Haseeb. Influence of Laser Power on Bonding Strength for Low Purity Copper Wire Bonding Technology. Elsevier, 2019.
Warning: These citations may not always be 100% accurate.