Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment

In this work, the iron (Fe) and bismuth (Bi) added (0.05 wt% Fe and 1 wt% or 2 wt% Bi) Sn-1Ag-0.5Cu (SAC105) lead-free solder alloys were prepared and their microstructure and tensile properties under severe thermal environments were extensively investigated and compared with the base alloy SAC105....

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Bibliographic Details

Main Authors:	Ali, Bakhtiar, Sabri, Mohd Faizul Mohd, Said, Suhana Mohd, Sukiman, Nazatul Liana, Jauhari, Iswadi, Mahdavifard, Mohammad Hossein
Format:	Article
Published:	Elsevier 2018
Subjects:	TJ Mechanical engineering and machinery TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.um.edu.my/22563/ https://doi.org/10.1016/j.microrel.2018.01.015
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