Bashir, M. N., & Haseeb, A. M. A. (2018). Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux. Springer.
Chicago Style (17th ed.) CitationBashir, Muhammad Nasir, and A.S. Md. Abdul Haseeb. Improving Mechanical and Electrical Properties of Cu/SAC305/Cu Solder Joints Under Electromigration by Using Ni Nanoparticles Doped Flux. Springer, 2018.
MLA (9th ed.) CitationBashir, Muhammad Nasir, and A.S. Md. Abdul Haseeb. Improving Mechanical and Electrical Properties of Cu/SAC305/Cu Solder Joints Under Electromigration by Using Ni Nanoparticles Doped Flux. Springer, 2018.
Warning: These citations may not always be 100% accurate.