Ismail, N., Jalar, A., Abu Bakar, M., & Ismail, R. (2018). Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma (Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging). Penerbit Universiti Kebangsaan Malaysia.
Chicago Style (17th ed.) CitationIsmail, Norliza, Azman Jalar, Maria Abu Bakar, and Roslina Ismail. Kesan Penambahan Tiubnano Karbon Terhadap Pertumbuhan Lapisan Sebatian Antara Logam Sistem Pateri Sn-Ag-Cu/Cu Akibat Penuaan Terma (Effect of Carbon Nanotube Addition on the Growth of Intermetallic Layer of Sn-Ag-Cu Solder System Under Thermal Aging). Penerbit Universiti Kebangsaan Malaysia, 2018.
MLA (9th ed.) CitationIsmail, Norliza, et al. Kesan Penambahan Tiubnano Karbon Terhadap Pertumbuhan Lapisan Sebatian Antara Logam Sistem Pateri Sn-Ag-Cu/Cu Akibat Penuaan Terma (Effect of Carbon Nanotube Addition on the Growth of Intermetallic Layer of Sn-Ag-Cu Solder System Under Thermal Aging). Penerbit Universiti Kebangsaan Malaysia, 2018.
