Yau, Y. H., Hua, S. N., & Kok, C. K. (2018). Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts. Elsevier.
Chicago Style (17th ed.) CitationYau, Yat Huang, Shijie Norman Hua, and Chee Kuang Kok. Structural Failure Analysis of Polycarbonate Enclosures of Electronic Devices Subjected to Multiple Ball Impacts. Elsevier, 2018.
MLA (9th ed.) CitationYau, Yat Huang, et al. Structural Failure Analysis of Polycarbonate Enclosures of Electronic Devices Subjected to Multiple Ball Impacts. Elsevier, 2018.
Warning: These citations may not always be 100% accurate.