Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints

Cu/SAC305/Cu solder joints were fabricated at ambient atmosphere using high-power-low-frequency ultrasonic vibration (USV) assisted hot plate reflow soldering. The influences of USV time (within 6 s) on the microstructure, hardness, yield strength and shear strength of the solder joints were investi...

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Bibliographic Details

Main Authors:	Tan, A.T., Tan, A.W., Yusof, F.
Format:	Article
Published:	Elsevier 2016
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.um.edu.my/17717/ http://dx.doi.org/10.1016/j.jmatprotec.2016.06.036
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