Characterisation of insulated Cu wire ball bonding

Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and...

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Bibliographic Details

Main Authors:	Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.
Format:	Article
Published:	Maney Publishing 2014
Subjects:	Q Science (General)
Online Access:	http://eprints.um.edu.my/15473/
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