APA (7th ed.) Citation

Ali, S., Teh, S., & Ang, B. (2014). Wire sweep improvement study of multi-tier palladium-copper wire bonding on low-quad flat package using low-alpha green mould compound. Springer Verlag (Germany).

Chicago Style (17th ed.) Citation

Ali, S.S.S, S.S.H Teh, and B.C Ang. Wire Sweep Improvement Study of Multi-tier Palladium-copper Wire Bonding on Low-quad Flat Package Using Low-alpha Green Mould Compound. Springer Verlag (Germany), 2014.

MLA (9th ed.) Citation

Ali, S.S.S, et al. Wire Sweep Improvement Study of Multi-tier Palladium-copper Wire Bonding on Low-quad Flat Package Using Low-alpha Green Mould Compound. Springer Verlag (Germany), 2014.