Effect of addition cobalt nanoparticles on Sn-Ag-Cu lead-free solder

Nowadays, nanoelectroctronic, electro-nanotechnologies environmental friendly products become the roadmap in industry. Hence, nanoscale of reinforcement into lead-free solder becomes more popular rather than the micro size of reinforcement. In this paper, Cobalt nanoparticles-reinforced Sn-Ag-Cu...

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Bibliographic Details

Main Authors:	Tay, S.L., Haseeb, A.S. Md. Abdul, Johan, Mohd Rafie
Format:	Conference or Workshop Item
Language:	en
Published:	2010
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.um.edu.my/12918/1/E1.4-P0283.pdf http://eprints.um.edu.my/12918/
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