APA (7th ed.) Citation

Tay, S., Haseeb, A. M. A., Johan, M., Munroe, P., & Quadir, M. (2013). Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate. Elsevier.

Chicago Style (17th ed.) Citation

Tay, S.L, A.S. Md. Abdul Haseeb, M.R Johan, P.R Munroe, and M.Z Quadir. Influence of Ni Nanoparticle on the Morphology and Growth of Interfacial Intermetallic Compounds Between Sn–3.8Ag–0.7Cu Lead-free Solder and Copper Substrate. Elsevier, 2013.

MLA (9th ed.) Citation

Tay, S.L, et al. Influence of Ni Nanoparticle on the Morphology and Growth of Interfacial Intermetallic Compounds Between Sn–3.8Ag–0.7Cu Lead-free Solder and Copper Substrate. Elsevier, 2013.