Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah
This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.
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| Format: | Article |
| Language: | en |
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Universiti Teknologi MARA Pulau Pinang
2011
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| Online Access: | https://ir.uitm.edu.my/id/eprint/8790/1/MAZLAN%20MOHAMED.pdf https://ir.uitm.edu.my/id/eprint/8790/ |
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| _version_ | 1833058491176058880 |
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| author | Mohamed, Mazlan Atan, Rahim Abdullah, Mohd Zulkifly |
| author_facet | Mohamed, Mazlan Atan, Rahim Abdullah, Mohd Zulkifly |
| author_sort | Mohamed, Mazlan |
| building | Tun Abdul Razak Library |
| collection | Institutional Repository |
| content_provider | Universiti Teknologi Mara |
| content_source | UiTM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package. |
| format | Article |
| id | my.uitm.ir-8790 |
| institution | Universiti Teknologi Mara |
| language | en |
| publishDate | 2011 |
| publisher | Universiti Teknologi MARA Pulau Pinang |
| record_format | eprints |
| spelling | my.uitm.ir-87902022-06-16T08:27:08Z https://ir.uitm.edu.my/id/eprint/8790/ Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah esteem Mohamed, Mazlan Atan, Rahim Abdullah, Mohd Zulkifly Heat This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package. Universiti Teknologi MARA Pulau Pinang 2011 Article NonPeerReviewed text en https://ir.uitm.edu.my/id/eprint/8790/1/MAZLAN%20MOHAMED.pdf Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah. (2011) ESTEEM Academic Journal <https://ir.uitm.edu.my/view/publication/ESTEEM_Academic_Journal/>, 7 (1). ISSN 1675-7939 |
| spellingShingle | Heat Mohamed, Mazlan Atan, Rahim Abdullah, Mohd Zulkifly Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah |
| title | Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah |
| title_full | Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah |
| title_fullStr | Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah |
| title_full_unstemmed | Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah |
| title_short | Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah |
| title_sort | three dimensional analysis using finite volume based cfd simulation to determine junction temperature on electronic components / mazlan mohamed, rahim atan and mohd zulkifly abdullah |
| topic | Heat |
| url | https://ir.uitm.edu.my/id/eprint/8790/1/MAZLAN%20MOHAMED.pdf https://ir.uitm.edu.my/id/eprint/8790/ |
| url_provider | http://ir.uitm.edu.my/ |