Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri
The intermetallic growth kinetics between Cu/Sn-3.5Ag-0.1Ni/Cu interfacial reactions were studied during reflow aging at 250℃ for 1, 10, 20, 30 and 40 minutes using Cu/Sn- 3.5Ag-0.1Ni/Cu sandwich solder. A typical Sn-Cu-Ni intermetallic compound layer was formed lower and upper interfacial after ref...
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| Format: | Student Project |
| Language: | en |
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2021
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| Online Access: | https://ir.uitm.edu.my/id/eprint/49657/1/49657.pdf https://ir.uitm.edu.my/id/eprint/49657/ |
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| author | Sukri, Wan Nur Suhaiza |
| author_facet | Sukri, Wan Nur Suhaiza |
| author_sort | Sukri, Wan Nur Suhaiza |
| building | Tun Abdul Razak Library |
| collection | Institutional Repository |
| content_provider | Universiti Teknologi Mara |
| content_source | UiTM Institutional Repository |
| continent | Asia |
| country | Malaysia |
| description | The intermetallic growth kinetics between Cu/Sn-3.5Ag-0.1Ni/Cu interfacial reactions were studied during reflow aging at 250℃ for 1, 10, 20, 30 and 40 minutes using Cu/Sn- 3.5Ag-0.1Ni/Cu sandwich solder. A typical Sn-Cu-Ni intermetallic compound layer was formed lower and upper interfacial after reflow. A (Cu, Ni)6Sn5 intermetallic compound layer was observed at both lower and upper Cu/Sn-3.5Ag-0.1Ni/Cu interface. The classical kinetic theory may clearly explain the growth kinetics of the overall interfacial intermetallic compound layer for this study. In addition, the lower interfacial has thicker intermetallic compound and higher intermetallic growth kinetics than upper interfacial. |
| format | Student Project |
| id | my.uitm.ir-49657 |
| institution | Universiti Teknologi Mara |
| language | en |
| publishDate | 2021 |
| record_format | eprints |
| spelling | my.uitm.ir-496572021-10-29T02:21:23Z https://ir.uitm.edu.my/id/eprint/49657/ Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri Sukri, Wan Nur Suhaiza Descriptive and experimental mechanics Composite materials The intermetallic growth kinetics between Cu/Sn-3.5Ag-0.1Ni/Cu interfacial reactions were studied during reflow aging at 250℃ for 1, 10, 20, 30 and 40 minutes using Cu/Sn- 3.5Ag-0.1Ni/Cu sandwich solder. A typical Sn-Cu-Ni intermetallic compound layer was formed lower and upper interfacial after reflow. A (Cu, Ni)6Sn5 intermetallic compound layer was observed at both lower and upper Cu/Sn-3.5Ag-0.1Ni/Cu interface. The classical kinetic theory may clearly explain the growth kinetics of the overall interfacial intermetallic compound layer for this study. In addition, the lower interfacial has thicker intermetallic compound and higher intermetallic growth kinetics than upper interfacial. 2021-08-17 Student Project NonPeerReviewed text en https://ir.uitm.edu.my/id/eprint/49657/1/49657.pdf Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri. (2021) [Student Project] <http://terminalib.uitm.edu.my/49657.pdf> (Unpublished) |
| spellingShingle | Descriptive and experimental mechanics Composite materials Sukri, Wan Nur Suhaiza Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri |
| title | Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri |
| title_full | Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri |
| title_fullStr | Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri |
| title_full_unstemmed | Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri |
| title_short | Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri |
| title_sort | intermetallic growth kinetics for sn-3.5ag-0.1ni solder sandwiched between two copper substrates / wan nur suhaiza sukri |
| topic | Descriptive and experimental mechanics Composite materials |
| url | https://ir.uitm.edu.my/id/eprint/49657/1/49657.pdf https://ir.uitm.edu.my/id/eprint/49657/ |
| url_provider | http://ir.uitm.edu.my/ |