Sukri, W. N. S. (2021). Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri.
Chicago Style (17th ed.) CitationSukri, Wan Nur Suhaiza. Intermetallic Growth Kinetics for Sn-3.5Ag-0.1Ni Solder Sandwiched Between Two Copper Substrates / Wan Nur Suhaiza Sukri. 2021.
MLA (9th ed.) CitationSukri, Wan Nur Suhaiza. Intermetallic Growth Kinetics for Sn-3.5Ag-0.1Ni Solder Sandwiched Between Two Copper Substrates / Wan Nur Suhaiza Sukri. 2021.
Warning: These citations may not always be 100% accurate.
