APA (7th ed.) Citation

Lum, W. C., Lee, S. H., Antov, P., Lubis, M. A. R., Kristak, L., & Hrusovsky, D. (2023). Effects of particles moisture, conditioning environment, and heat treatment on the formaldehyde emission of urea formaldehyde-bonded particleboard. Universiti Teknologi MARA (UiTM).

Chicago Style (17th ed.) Citation

Lum, Wei Chen, Seng Hua Lee, Petar Antov, Muhammad Adly Rahandi Lubis, Lubos Kristak, and Dominik Hrusovsky. Effects of Particles Moisture, Conditioning Environment, and Heat Treatment on the Formaldehyde Emission of Urea Formaldehyde-bonded Particleboard. Universiti Teknologi MARA (UiTM), 2023.

MLA (9th ed.) Citation

Lum, Wei Chen, et al. Effects of Particles Moisture, Conditioning Environment, and Heat Treatment on the Formaldehyde Emission of Urea Formaldehyde-bonded Particleboard. Universiti Teknologi MARA (UiTM), 2023.