Mayappan, R. (2024). The evolution of interfacial intermetallic compound growth and solder joint strength of Sn-40Pb/Cu under thermal aging / Ramani Mayappan. Penerbit UiTM (UiTM Press).
Chicago Style (17th ed.) CitationMayappan, Ramani. The Evolution of Interfacial Intermetallic Compound Growth and Solder Joint Strength of Sn-40Pb/Cu Under Thermal Aging / Ramani Mayappan. Penerbit UiTM (UiTM Press), 2024.
MLA (9th ed.) CitationMayappan, Ramani. The Evolution of Interfacial Intermetallic Compound Growth and Solder Joint Strength of Sn-40Pb/Cu Under Thermal Aging / Ramani Mayappan. Penerbit UiTM (UiTM Press), 2024.
Warning: These citations may not always be 100% accurate.