Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS)
This study aims to evaluate the effect of copper (Cu) substrate surface roughness on the intermetallic compound (IMC) growth and interfacial reaction of SAC305 lead-free solder joint after undergone an aging process. Aging process was conducted using high temperature storage (HTS) at temperature o...
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| Language: | en |
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Penerbit Universiti Kebangsaan Malaysia
2020
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| Online Access: | http://journalarticle.ukm.my/16169/1/16.pdf http://journalarticle.ukm.my/16169/ https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html |
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| author | Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Kim, Siow Shyong |
| author_facet | Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Kim, Siow Shyong |
| author_sort | Rabiah Al Adawiyah Ab Rahim, |
| building | Tun Sri Lanang Library |
| collection | Institutional Repository |
| content_provider | Universiti Kebangsaan Malaysia |
| content_source | UKM Journal Article Repository |
| continent | Asia |
| country | Malaysia |
| description | This study aims to evaluate the effect of copper (Cu) substrate surface roughness on the intermetallic compound (IMC)
growth and interfacial reaction of SAC305 lead-free solder joint after undergone an aging process. Aging process was
conducted using high temperature storage (HTS) at temperature of 150 °C and aging times of 200, 400, 600, 800, and
1000 h. IMC morphology and growth were examined using infinite focus microscope (IFM). Then, the SAC305 solder
joint IMC growth kinetic was measured based on power law relationship and diffusion coefficient formula. It was noted
that the morphology of IMC for the rougher Cu substrate has scallop-shaped and uniform layer as compared to that
of smoother Cu substrate for the initial exposure to the HTS. In addition, Cu substrate with Ra
of 579 nm is the turning
point for the creation of Cu6
Sn5
towards more Cu3
Sn of IMC. In addition, Cu substrate with Ra
of 579 nm also acts as
the turning point for the IMC growth of SAC305 solder joint on Cu substrate for the solid-state diffusion to be happened
during 150 °C of aging from grain boundary dominant toward volume diffusion dominant. |
| format | Article |
| id | my-ukm.journal.16169 |
| institution | Universiti Kebangsaan Malaysia |
| language | en |
| publishDate | 2020 |
| publisher | Penerbit Universiti Kebangsaan Malaysia |
| record_format | eprints |
| spelling | my-ukm.journal.161692021-02-13T13:26:56Z http://journalarticle.ukm.my/16169/ Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS) Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Kim, Siow Shyong This study aims to evaluate the effect of copper (Cu) substrate surface roughness on the intermetallic compound (IMC) growth and interfacial reaction of SAC305 lead-free solder joint after undergone an aging process. Aging process was conducted using high temperature storage (HTS) at temperature of 150 °C and aging times of 200, 400, 600, 800, and 1000 h. IMC morphology and growth were examined using infinite focus microscope (IFM). Then, the SAC305 solder joint IMC growth kinetic was measured based on power law relationship and diffusion coefficient formula. It was noted that the morphology of IMC for the rougher Cu substrate has scallop-shaped and uniform layer as compared to that of smoother Cu substrate for the initial exposure to the HTS. In addition, Cu substrate with Ra of 579 nm is the turning point for the creation of Cu6 Sn5 towards more Cu3 Sn of IMC. In addition, Cu substrate with Ra of 579 nm also acts as the turning point for the IMC growth of SAC305 solder joint on Cu substrate for the solid-state diffusion to be happened during 150 °C of aging from grain boundary dominant toward volume diffusion dominant. Penerbit Universiti Kebangsaan Malaysia 2020-12 Article PeerReviewed application/pdf en http://journalarticle.ukm.my/16169/1/16.pdf Rabiah Al Adawiyah Ab Rahim, and Muhammad Nubli Zulkifli, and Azman Jalar, and Atiqah Mohd Afdzaluddin, and Kim, Siow Shyong (2020) Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS). Sains Malaysiana, 49 (12). pp. 3045-3054. ISSN 0126-6039 https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html |
| spellingShingle | Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Kim, Siow Shyong Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS) |
| title | Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS) |
| title_full | Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS) |
| title_fullStr | Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS) |
| title_full_unstemmed | Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS) |
| title_short | Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS) |
| title_sort | effect of isothermal aging and copper substrate roughness on the sac305 solder joint intermetallic layer growth of high temperature storage (hts) |
| url | http://journalarticle.ukm.my/16169/1/16.pdf http://journalarticle.ukm.my/16169/ https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html |
| url_provider | http://journalarticle.ukm.my/ |