Search Results - Yusof F.B.

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  1. 1
    Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications

    Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications by Ng Q.Q., Tan C.Y., Wong Y.H., Yap B.K., Yusof F.B., Saher S.

    Published 2025
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  2. 2
    3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process

    3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process by Mohammad Nazri M.H., Yong T.C., Yusof F.B., Soon How Thien G., Yoong C.K., Kar Y.B.

    Published 2025
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