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    Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS

    Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS by Lau, Chun Sean, Abdullah, M. Z., Mujeebu, M. Abdul, Yusof, N. Md

    Published 2014
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