Search Results - Shualdi W.
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1
Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging by Shualdi W., Ahmad I., Omar G., Isnin A.
Published 2023Conference paper -
2
Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging by Shualdi W., Bais B., Ahmad I., Omar G., Isnin A.
Published 2023Conference paper
