Search Results - Shualdi W.

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    Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

    Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging by Shualdi W., Ahmad I., Omar G., Isnin A.

    Published 2023
    Conference paper
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  2. 2
    Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

    Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging by Shualdi W., Bais B., Ahmad I., Omar G., Isnin A.

    Published 2023
    Conference paper
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