Search Results - Shi K.W.

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  1. 1
    Ultraviolet Laser Diode Ablation Process for CMOS 45 nm Copper Low-K Semiconductor Wafer

    Ultraviolet Laser Diode Ablation Process for CMOS 45 nm Copper Low-K Semiconductor Wafer by Shi K.W., Kar Y.B., Talik N.A., Yew L.W.

    Published 2023
    Conference Paper
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  2. 2
    Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

    Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer by Shi K.W., Yow K.Y., Lo C.

    Published 2023
    Conference Paper
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  3. 3
    Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

    Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer by Shi K.W., Yow K.Y., Lo C., Kar Y.B., Misran H.

    Published 2023
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