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    Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

    Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate by Tay, S.L., Haseeb, A.S. Md. Abdul, Johan, M.R., Munroe, P.R., Quadir, M.Z.

    Published 2013
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