Search Results - Muhammad Nubli Zulkifli,

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  1. 1
    Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS)

    Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS) by Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Kim, Siow Shyong

    Published 2020
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  2. 2
    Temperature cycling analysis for ball grid array package using finite element analysis

    Temperature cycling analysis for ball grid array package using finite element analysis by Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Prof. Dr., Ghulam, Abdul Quadir

    Published 2011
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  3. 3
    Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

    Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA) by Muhammad Nubli, Zulkifli

    Published 2010
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