Search Results - Mayappan, Ramani

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  1. 1
    Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization

    Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization by Mayappan, Ramani

    Published 2007
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  2. 2
    Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].

    Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. by Mayappan, Ramani

    Published 2007
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  3. 3
    Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method

    Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method by Iziana, Yahya, Noor Asikin, Ab Ghani, Mohd Arif Anuar, Mohd Salleh, Hamidi, Abd Hamid, Zainal Arifin, Ahmad, Mayappan, Ramani

    Published 2013
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  4. 4
    The evolution of interfacial intermetallic compound growth and solder joint strength of Sn-40Pb/Cu under thermal aging / Ramani Mayappan

    The evolution of interfacial intermetallic compound growth and solder joint strength of Sn-40Pb/Cu under thermal aging / Ramani Mayappan by Mayappan, Ramani

    Published 2024
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  5. 5
    Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad

    Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad by Mayappan, Ramani, Ahmad, Zainal Arifin

    Published 2010
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  6. 6
    The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan

    The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan by Yahya, Iziana, Abd Hamid, Hamidi, Mayappan, Ramani

    Published 2012
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  7. 7
    Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya

    Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya by Mayappan, Ramani, Yahya, Iziana

    Published 2025
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