Search Results - Leong P.
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C45 ultra low k wafer technology with Cu wire bonding by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K., Siew C., Sivakumar, Kid W.B., Weily C.
Published 2023Conference Paper -
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The effects of age on clinical characteristics, hospitalization and mortality of patients with influenza‐related illness at a tertiary care centre in Malaysia by Wong, Pui Li, Sii, Hoe Leong, P'ng, Chun Keat, Ee, Soon Sean, Yong Oong, Xiang, Ng, Kim Tien, Hanafi, Nik Sherina, Tee, Kok Keng, Tan, Maw Pin
Published 2020Get full text
Get full text
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Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K.S., Siew C.W., Sivakumar, Kid W.B., Weily C.
Published 2023Conference paper
