Search Results - Jalar, Azman

  • Showing 1 - 7 results of 7
Refine Results
  1. 1
    High Sensitivity pH Sensor Based on Porous Silicon (PSi) Extended Gate Field-Effect Transistor

    High Sensitivity pH Sensor Based on Porous Silicon (PSi) Extended Gate Field-Effect Transistor by Al-Hardan, Naif H., Abdul Hamid, Muhammad Azmi, M. Ahmed, Naser, Jalar, Azman, Shamsudin, Roslinda, Kamil Othman, Norinsan, Lim, Kar Keng, Chiu, Weesiong, N. Al-Rawi, Hamzah

    Published 2016
    Get full text
    Get full text
    Get full text
    Article
    Save to List
    Saved in:
  2. 2
    Micro-structural Studies of Thermosonic Cu-Al Bonding Interface

    Micro-structural Studies of Thermosonic Cu-Al Bonding Interface by Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Jalar, Azman

    Published 2014
    Get full text
    Get full text
    Get full text
    Article
    Save to List
    Saved in:
  3. 3
    Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability

    Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability by Ismail, Norliza, Ismail, Roslina, Jalar, Azman, Omar, Ghazali, Salleh, Emee Marina, Kamil, Norinsan, Rahman, Irman Abdul

    Published 2018
    Get full text
    Get full text
    Article
    Save to List
    Saved in:
  4. 4
    Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma (Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging)

    Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma (Effect of carbon nanotube addition on the growth... by Ismail, Norliza, Jalar, Azman, Abu Bakar, Maria, Ismail, Roslina

    Published 2018
    Get full text
    Get full text
    Article
    Save to List
    Saved in:
  5. 5
    Micro-structural studies of thermosonic Cu-Al bonding interface

    Micro-structural studies of thermosonic Cu-Al bonding interface by Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Jalar, Azman

    Published 2013
    Get full text
    Get full text
    Get full text
    Conference or Workshop Item
    Save to List
    Saved in:
  6. 6
    Thermo-Mechanical And Adhesion Performance Of Silver-Filled Conductive Polymer Composite (SFCP) Using Thermoplastic Polyurethane (TPU) Substrate

    Thermo-Mechanical And Adhesion Performance Of Silver-Filled Conductive Polymer Composite (SFCP) Using Thermoplastic Polyurethane (TPU) Substrate by Omar, Ghazali, A Hamid, Husna, Azli, Siti Ashikin, Jasmee, Solehah, Jalar, Azman, Tamaldin, Noreffendy, Che Ani, Fakhrozi

    Published 2020
    Get full text
    Get full text
    Get full text
    Article
    Save to List
    Saved in:
  7. 7
    Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/cnt/cu menggunakan pelekukan nano (Effect of isothermal aging on microhardness properties of Sn-Ag-Cu/CNT/Cu using nanoindentation)

    Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/cnt/cu menggunakan pelekukan nano (Effect of isothermal aging on microhardness properties of Sn-Ag-Cu/CNT/C... by Ismail, Norliza, Jalar, Azman, Abu Bakar, Maria, Ismail, Roslina, Safee, Nur Shafiqa, Ismail, Ahmad Ghadafi, Ibrahim, Najib Saedi

    Published 2019
    Get full text
    Get full text
    Article
    Save to List
    Saved in:

Search Tools: