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    Compound development of fe80cr20 metallic interconnect by ball milling and ultrasonic technique: its effect on mass gradation

    Compound development of fe80cr20 metallic interconnect by ball milling and ultrasonic technique: its effect on mass gradation by Dafit Feriyanto, Hadi Pranoto, Dedik Romahadi, Imam hidayat, Spaatz Zakaria

    Published 2023
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