Search Results - Harun, Fuaida

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  1. 1
    Solving eventual bonding quality to enhance adhesion for QFN packages

    Solving eventual bonding quality to enhance adhesion for QFN packages by Suresh, Kumar, Subramonian, Sivarao, Cheong MT, Mohd Azmeer, Harun, Fuaida

    Published 2010
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  2. 2
    Chipping free process for combination of narrow saw street (60UM) and thick wafer (600UM) sawing process

    Chipping free process for combination of narrow saw street (60UM) and thick wafer (600UM) sawing process by Mohd Noh, Mohd Syahrin Amri, Liew, David, Harun, Fuaida

    Published 2010
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  3. 3
    Wafer dicing vibration investigation on novel wafer mounting techniques

    Wafer dicing vibration investigation on novel wafer mounting techniques by Mohd Noh, Mohd Syahrin Amri, Omar, Ghazali, Mispan, Mohd Syafiq, Harun, Fuaida, Othman, Md Nazri, Ngatiman, Nor Azazi, Mat Ibrahim, Masrullizam

    Published 2024
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  4. 4
    Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process

    Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process by Mohd Noh, Mohd Syahrin Amri, Liew, David, Harun, Fuaida

    Published 2010
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  5. 5
    Influence of Wafer Probing Against Initial Bonding

    Influence of Wafer Probing Against Initial Bonding by Suresh, Kumar, Sivarao, Subramonian, Guan, Tan Kim, Harun, Fuaida

    Published 2010
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