Search Results - Chahal, P

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  1. 1
    3D Printed Interposer Layer for High Density Packaging of IoT Devices

    3D Printed Interposer Layer for High Density Packaging of IoT Devices by Mondal, S, Ghazali, MIM, Wijewardena, K, Kumar, D, Chahal, P

    Published 2024
    Proceedings Paper
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  2. 2
    3D Printed Substrates for the Design of Compact RF Systems

    3D Printed Substrates for the Design of Compact RF Systems by Ghazalil, MIM, Mondal, S, Karuppuswami, S, Chahal, P

    Published 2024
    Proceedings Paper
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  3. 3
    3D printed interposer layer for high density packaging of IoT devices

    3D printed interposer layer for high density packaging of IoT devices by Mondal S., Mohd Ghazali M.I., Wijewardena K., Kumar D., Chahal P.

    Published 2024
    conference output::conference proceedings::conference paper
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  4. 4
    Embedded Actives Using Additive Manufacturing for High-Density RF Circuits and Systems

    Embedded Actives Using Additive Manufacturing for High-Density RF Circuits and Systems by Ghazali, MIM, Karuppuswami, S, Mondal, S, Kaur, A, Chahal, P

    Published 2024
    Article
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  5. 5
    3D Printed high functional density packaging compatible out-of-plane antennas

    3D Printed high functional density packaging compatible out-of-plane antennas by Ghazali, MIM, Karuppuswami, S, Kaur, A, Chahal, P

    Published 2024
    Article
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  6. 6
    3D printed substrates for the design of compact RF systems

    3D printed substrates for the design of compact RF systems by Mohd Ghazali M.I., Mondal S., Karuppuswami S., Chahal P.

    Published 2024
    conference output::conference proceedings::conference paper
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