Search Results - Bais B.H.

  • Showing 1 - 1 results of 1
Refine Results
  1. 1
    Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates

    Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates by Muhammad N.A., Bais B.H., Ahmad I., Isnin A.

    Published 2023
    Conference paper
    Save to List
    Saved in:

Search Tools: