Search Results - Azmah Hanim, Mohamad Ariff

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  1. 1
    Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method

    Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman

    Published 2015
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  2. 2
    Effect of Reflow Soldering Profile on Intermetallic Compound Formation

    Effect of Reflow Soldering Profile on Intermetallic Compound Formation by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman

    Published 2015
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  3. 3
    Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers

    Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers by Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman, Siti Rabiatull Aisha, Idris

    Published 2013
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  4. 4
    Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers

    Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers by Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman

    Published 2013
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  5. 5
    Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish

    Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish by Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman, Ali, Ourdjini, Azmah Hanim, Mohamad Ariff

    Published 2012
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  6. 6
    Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes

    Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes by Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ali, Ourdjini, Saliza Azlina, Osman

    Published 2015
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  7. 7
    Effect of Reflow Profile on Intermetallic Compound Formation

    Effect of Reflow Profile on Intermetallic Compound Formation by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman

    Published 2013
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  8. 8
    Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

    Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes by Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman

    Published 2015
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