Search Results - Ali, Ourdjini

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  1. 1
    Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes

    Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes by Siti Rabiatull Aisha, Idris, Ali, Ourdjini, Saliza Azlina, Osman

    Published 2011
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  2. 2
    Effect of Multiple Reflow on IMC Formation using Various Surface Finishes

    Effect of Multiple Reflow on IMC Formation using Various Surface Finishes by Siti Rabiatull Aisha, Idris, Ali, Ourdjini

    Published 2013
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  3. 3
    Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate

    Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate by Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman, Ali, Ourdjini

    Published 2012
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  4. 4
    Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish

    Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish by Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman, Ali, Ourdjini, Astuty, Amrin

    Published 2014
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  5. 5
    Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish

    Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish by Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman, Ali, Ourdjini, Azmah Hanim, Mohamad Ariff

    Published 2012
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  6. 6
    Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper

    Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper by Siti Rabiatull Aisha, Idris, Ali, Ourdjini, Y.T., Chin

    Published 2012
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  7. 7
    Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper

    Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper by Siti Rabiatull Aisha, Idris, Ali, Ourdjini, Y. T., Chin

    Published 2012
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  8. 8
    Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes

    Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes by Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ali, Ourdjini, Saliza Azlina, Osman

    Published 2015
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