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    Recent advances on thermally conductive adhesive in electronic packaging: A review

    Recent advances on thermally conductive adhesive in electronic packaging: A review by Alim M.D., Abdullah M.Z., Aziz M.S.A., Kamarudin R., Gunnasegaran P.

    Published 2023
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    Review
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    Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging

    Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging by Alim M.A., Abdullah M.Z., Aziz M.S.A., Kamarudin R., Rusdi M.S., Ishak M.H.H., Gunnasegaran P.

    Published 2023
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    Book Chapter
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