Search Results - 55787052600

Insulated Cu wire free air ball characterization by Leong H., Yap B., Khan N., Ibrahim M.R., Tan L.C.

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Analysis of Transmission Performance for Fine Pitch Interconnect by Leong H.Y., Yap B.K., Chin L.P., Zuraida E.E., Awang Mat Z.

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Stitch bond strength study in insulated Cu wire bonding by Leong H.Y., Yap B.K., Khan N., Ibrahim M.R., Tan L.C., Faiz M.

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Characterisation of insulated Cu wire ball bonding by Leong H.Y., Yap B.K., Khan N., Ibrahim M.R., Tan L.C., Faiz M.

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Development of insulated Cu wire ball bonding by Leong H.Y., Mohd F.Z., Ibrahim M.R., Kid W.B., Khan N., Kar Y.B., Tan L.C.

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