Search Results - 36992192300
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1
Process optimization approach in fine pitch Cu wire bonding by Wong B.K., Yong C.C., Eu P.L., Yap B.K.
Published 2023Other Authors: “…36992192300…”
Conference paper -
2
C45 ultra low k wafer technology with Cu wire bonding by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K., Siew C., Sivakumar, Kid W.B., Weily C.
Published 2023Conference Paper -
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Development of insulated Cu wire ball bonding by Leong H.Y., Mohd F.Z., Ibrahim M.R., Kid W.B., Khan N., Kar Y.B., Tan L.C.
Published 2023Conference paper -
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Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire by Kid W.B., Leng E.P., Seong L.B., Weily C., Kar Y.B.
Published 2023Other Authors: “…36992192300…”
Conference paper -
6
Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K.S., Siew C.W., Sivakumar, Kid W.B., Weily C.
Published 2023Conference paper
