Search Results - 36992192300

Process optimization approach in fine pitch Cu wire bonding by Wong B.K., Yong C.C., Eu P.L., Yap B.K.

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C45 ultra low k wafer technology with Cu wire bonding by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K., Siew C., Sivakumar, Kid W.B., Weily C.

Improvement of Cu-Al bond integrity on low k pad structures by Kid W.B., Leng E.P., Yong C.C., Yi O.X., Kar Y.B.

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Development of insulated Cu wire ball bonding by Leong H.Y., Mohd F.Z., Ibrahim M.R., Kid W.B., Khan N., Kar Y.B., Tan L.C.

Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire by Kid W.B., Leng E.P., Seong L.B., Weily C., Kar Y.B.

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Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K.S., Siew C.W., Sivakumar, Kid W.B., Weily C.