Search Results - 36605495300

Effects of anodisation parameters on thin film properties: a review by Wong Y.H., Affendy M.G., Lau S.K., Teh P.C., Lee H.J., Tan C.Y., Ramesh S.

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Effect of Attritor Milling on Synthesis and Sintering of Forsterite Ceramics by Tan Y.M., Tan C.Y., Ramesh S., Teh Y.C., Wong Y.H., Yap B.K.

Sintering properties of zirconia-based ceramic composite by Kelvin Chew W.J., Ramesh S., Wong Y.H., Misran H., Yusuf F., Tan C.Y., Amiriyan M., Tolouei R., Teng W.D.

Effect of sintering holding time on the properties and low-temperature degradation behaviour of manganese oxide-doped Y-TZP ceramic by Kwa S.M., Ramesh S., Bang L.T., Wong Y.H., Kelvin Chew W.J., Tan C.Y., Purbolaksono J., Misran H., Teng W.D.

Effect of Copper Oxide and Manganese Oxide on Properties and Low Temperature Degradation of Sintered Y-TZP Ceramic by Khan M.M., Ramesh S., Bang L.T., Wong Y.H., Ubenthiran S., Tan C.Y., Purbolaksono J., Misran H.

Effect of sintering holding time on lowtemperature degradation of yttria stabilized zirconia ceramics by Sutharsini U., Ramesh S., Wong Y.H., Misran H., Yusuf F., Tan C.Y., Purbolaksono J., Teng W.D.

Investigation of the effect of anodization time and annealing temperature on the physical properties of ZrO2 thin film on a Si substrate by Goh K.H., Lee H.J., Lau S.K., Teh P.C., Ramesh S., Tan C.Y., Wong Y.H.

Predictive analysis of the power spectral irradiance from blackbody radiation source using single pixel detector by Lee H.J., Ker P.J., Gamel M.M.A., Jamaludin M.Z., Wong Y.H.

Absorption Coefficient of Bulk III-V Semiconductor Materials: A Review on Methods, Properties and Future Prospects by Lee H.J., Gamel M.M.A., Ker P.J., Jamaludin M.Z., Wong Y.H., David J.P.R.

Deriving the absorption coefficients of lattice mismatched InGaAs using genetic algorithm by Lee H.J., Ali Gamel M.M., Ker P.J., Jamaludin M.Z., Wong Y.H., Yap K.S., Willmott J.R., Hobbs M.J., David J.P.R., Tan C.H.

Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications by Ng Q.Q., Tan C.Y., Wong Y.H., Yap B.K., Yusof F.B., Saher S.