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    A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages

    A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages by Amin N., Lim V., Seng F.C., Razid R., Ahmad I.

    Published 2023
    Article
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    Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

    Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package by Lim V., Ahmad I., Seng F.C., Amin N., Rasid R.

    Published 2023
    Other Authors: “…26432767800…”
    Conference Paper
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