Search Results - 26423002500

C45 ultra low k wafer technology with Cu wire bonding by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K., Siew C., Sivakumar, Kid W.B., Weily C.

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Improvement of Cu-Al bond integrity on low k pad structures by Kid W.B., Leng E.P., Yong C.C., Yi O.X., Kar Y.B.

Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire by Kid W.B., Leng E.P., Seong L.B., Weily C., Kar Y.B.

Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K.S., Siew C.W., Sivakumar, Kid W.B., Weily C.

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