APA引文

Ahmad, I. (2017). Optimization of nickel thickness on substrate for TBGA using SAC387 solder material.

Chicago Style Citation

Ahmad, I. Optimization of Nickel Thickness On Substrate for TBGA Using SAC387 Solder Material. 2017.

MLA引文

Ahmad, I. Optimization of Nickel Thickness On Substrate for TBGA Using SAC387 Solder Material. 2017.

警告：這些引文格式不一定是100％准確.