APA引文

W.B., K., & 36992192300. (2023). Improvement of Cu-Al bond integrity on low k pad structures.

Chicago Style Citation

W.B., Kid, and 36992192300. Improvement of Cu-Al Bond Integrity On Low K Pad Structures. 2023.

MLA引文

W.B., Kid, and 36992192300. Improvement of Cu-Al Bond Integrity On Low K Pad Structures. 2023.

警告：這些引文格式不一定是100％准確.