C., L. G., & pgg@yahoo.com, c. (2013). Technical barriers and development of Cu wirebonding in nanoelectronics device packaging. Hindawi Publishing Corporation.
استشهاد بنمط شيكاغوC., L. Gan, and clgan pgg@yahoo.com. Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging. Hindawi Publishing Corporation, 2013.
MLA استشهادC., L. Gan, and clgan pgg@yahoo.com. Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging. Hindawi Publishing Corporation, 2013.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.