Zakaria, S. A. F. S., & Bukhari, P. M. I. M. Z. S. (2012). Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application. Universiti Malaysia Perlis.
Chicago Style CitationZakaria, Siti Amira Faisha Shikh, and Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari. Effects of Volume Fraction and Particle Size Reinforcement Parameter On Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application. Universiti Malaysia Perlis, 2012.
MLA引文Zakaria, Siti Amira Faisha Shikh, and Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari. Effects of Volume Fraction and Particle Size Reinforcement Parameter On Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application. Universiti Malaysia Perlis, 2012.