Measurement of contact angle of silicone glue droplet on Cu surface in MEMS Microphone Package
This project is studying on the contact angle (CA) Measurement on the Copper (Cu) surface in MEMS Microphone Package. The CA measurement is of great importance to estimate the wettability of the Silicon glue on the Cu surface as it can affect the adhesiveness performance of the Silicon glue during t...
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| 第一著者: | |
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| フォーマット: | Undergraduates Project Papers |
| 言語: | English |
| 出版事項: |
2017
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| 主題: | |
| オンライン･アクセス: | http://umpir.ump.edu.my/id/eprint/25750/1/Measurement%20of%20contact%20angle%20of%20silicone%20glue%20droplet%20on%20Cu%20surface.pdf http://umpir.ump.edu.my/id/eprint/25750/ |
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