صورة الغلاف

Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys

The present study focuses on coarsening of Ag3Sn intermetallic compound in the Sn-1Ag-0.5Cu and Fe-modified Sn-1Ag-0.5Cu solder alloy. The investigations showed that the Ag3Sn intermetallics coarsened rapidly in the Sn-1Ag-0.5Cu solder alloy whereas the Ag3Sn intermetallics were found to be quite st...

وصف كامل

محفوظ في:
التفاصيل البيبلوغرافية
المؤلفون الرئيسيون: Shnawah, D.A., Sabri, M.F.M., Badruddin, I.A., Said, S.M., Bashir, M.B.A., Sharif, N.M., Elsheikh, M.H.
التنسيق: مقال
اللغة:English
منشور في: 2015
الموضوعات:
T Technology (General)
TJ Mechanical engineering and machinery
TK Electrical engineering. Electronics Nuclear engineering
الوصول للمادة أونلاين:http://eprints.um.edu.my/13908/1/Study_on_coarsening_of_Ag3Sn_intermetallic_compound_in_the_Fe.pdf
http://eprints.um.edu.my/13908/
http://www.sciencedirect.com/science/article/pii/S0925838814024621
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الوصف
الملخص:The present study focuses on coarsening of Ag3Sn intermetallic compound in the Sn-1Ag-0.5Cu and Fe-modified Sn-1Ag-0.5Cu solder alloy. The investigations showed that the Ag3Sn intermetallics coarsened rapidly in the Sn-1Ag-0.5Cu solder alloy whereas the Ag3Sn intermetallics were found to be quite stable in the Fe-modified Sn-1Ag-0.5Cu solder alloy. The lattice strain in the Ag3Sn intermetallics and the blocking effect on Ag diffusivity in Sn matrix suggested the possible mechanisms for the coarsening suppression of the Ag3Sn intermetallics in the Fe-modified solder alloy. (C) 2014 Elsevier B.V. All rights reserved.

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