APA引文

Akbar, M. A. (2025). Deep learning-based yield prediction for the die bonding semiconductor manufacturing process. Springer.

Chicago Style Citation

Akbar, Muhammad Ali. Deep Learning-based Yield Prediction for the Die Bonding Semiconductor Manufacturing Process. Springer, 2025.

MLA引文

Akbar, Muhammad Ali. Deep Learning-based Yield Prediction for the Die Bonding Semiconductor Manufacturing Process. Springer, 2025.

警告：这些引文格式不一定是100％准确.